Our Technology
At AET, we promise our customers to provide them with a safer delivery. Therefore, we have modern-packaging technologies. AET being the first enterprise to have both COB technology & MIP technology in the LED display industry, it has over 200 patents. Our self-developed Mass Transfer production line is setting the industry standard, producing an impressive 2 million chips per hour. It stands as the most advanced Mass Transfer Technology, boasting a remarkable 99.999% yield rate in Micro LED Technology
COB Technology
(Chip on Board)
MIP Technology
(Micro LED in Package)
BOB
(AET Patented Technology)
GOB Technology
.
SMD Technology
.
QCOB Multi-Layer On Board Laminate
(Packaging Technology)
COB Technology
(Chip on Board)
EXCELLENT R&D TECHNOLOGIES
Material
2D/3D Nano Quantum Dot Materials QD Led Chips
Drive IC
Micro LED Specialized Control ICs Driver ICs
Application
Micro Pitch LED Display Technology
Software
Embedded CPU Image Multiprocessing
Globally Present
80+ partners & and distributors,
present across 34 countries
and we’re planning to expand
more.
Top-Notch Product
Packaging
We’ve high-end modern packaging
technologies for safer delivery,
including - MIP & COB.
Priority Support
Enjoy free on site support
during the warranty period.
We also provide our customers
with technical support, ensuring
high-maintenance.
Training
Providing our customers with the
product training for better usage
without facing any obstacles is our
top-most priority.
24/7 Availability
We're always on our toes for you,
ready to assist whenever the need
arises.
Globally Present
80+ partners & and distributors,
present across 34 countries
and we’re planning to expand
more.
Top-Notch Product
Packaging
We’ve high-end modern packaging
technologies for safer delivery,
including - MIP & COB.
Priority Support
Enjoy free on site support
during the warranty period.
We also provide our customers
with technical support, ensuring
high-maintenance.
Training
Providing our customers with the
product training for better usage
without facing any obstacles is our
top-most priority.
TECHNOLOGIES
QCOB Technology
QCOB Technology (Multi-Layer On Board Laminate Packaging)
QCOB (Multi-Layer On Board Laminate Packaging) technology represents a significant advancement in LED display technology, particularly for products with pixel pitches greater than P1.0mm.
QCOB Key Features:
- Enhanced Protection: QCOB technology offers excellent protection against dust, moisture, and impact, ensuring long-term durability and reliability.
- Superior Display Quality: QCOB panels deliver high-quality visuals with vibrant colors and sharp images, comparable to COB technology but at a more cost-effective price point.
- Cost-Effectiveness: By effectively controlling manufacturing costs, QCOB technology provides a high-performance, high-value solution for LED displays.
- Future-Ready: With its advanced features and cost efficiency, QCOB is poised to become the mainstream technology for LED display protection and performance.
COB Technology
COB Technology (Chip on Board)
Chip on Board (COB) technology involves attaching bare LED chips directly to the PCB board, followed by encapsulation. This process creates a large, integrated LED module that offers several advantages over traditional SMD technology.
COB Key Features:
- Enhanced Protection: QCOB technology offers excellent protection against dust, moisture, and impact, ensuring long-term durability and reliability.
- Superior Display Quality: QCOB panels deliver high-quality visuals with vibrant colors and sharp images, comparable to COB technology but at a more cost-effective price point.
- Cost-Effectiveness: By effectively controlling manufacturing costs, QCOB technology provides a high-performance, high-value solution for LED displays.
- Future-Ready: With its advanced features and cost efficiency, QCOB is poised to become the mainstream technology for LED display protection and performance.
MIP Technology
MIP Technology (Micro LED in Package)
Micro LED in Package (MIP) technology represents a revolutionary approach to LED display manufacturing. It involves integrating Micro LEDs with flip-chip devices, with each display panel individually packaged.
MIP Key Features:
- Innovative Packaging: MIP technology uses a novel packaging architecture that combines Micro LEDs with flip-chip devices, resulting in superior performance and reliability.
- Enhanced Yield: The precise packaging process improves manufacturing yield, reducing defects and ensuring consistent quality.
- Cost Reduction: By optimizing the use of materials and streamlining the manufacturing process, MIP technology lowers production costs, making high-quality Micro LED displays more affordable.
- Improved Efficiency: MIP technology enhances overall efficiency, delivering brighter displays with lower power consumption and better thermal management.